The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Aug. 15, 2023
Applicant:
Nec Corporation, Tokyo, JP;
Inventors:
Assignee:
NEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01R 13/24 (2006.01); H01R 13/405 (2006.01); H10N 60/81 (2023.01);
U.S. Cl.
CPC ...
H10N 60/815 (2023.02); H01L 23/3675 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01R 13/03 (2013.01); H01R 13/2421 (2013.01); H01R 13/405 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A quantum device includes a quantum chip; an interposer flip chip mounting the quantum chip; and a socket including a housing has opening housing signal probe pins and ground probe pins. An inner wall of the opening housing the ground probe pin is covered with a metal layer, at least a part of the ground probe pin is thermally in contact with the metal layer of the inner wall which continues to a metal layer formed on at least a partial region of at least one of the first surface and the second surface of the housing.