Dual inline memory module heat sink for conduction cooled environments

Abstract

A system and method enabling the use of convection cooled dual-inline memory modules (DIMM) in non-convection environments, specifically used for computing applications for harsh environments. This system and method describes a design which transfers heat from the various components on the memory module to thermally opportunistic areas of an enclosure in the absence of sufficient or in some cases any convective cooling conditions. The system and method describes a sandwiched metal heat plate assembly, being constructed from a thermally conductive material, which is attached to a heat pipe, designed to be highly thermally conductive, which is further attached to a thermally conductive cold plate saddle, which in turn is connected to a thermal sink. The heat generated in the DIMM is conducted to the heat plate by way of a thermal interface material, this energy transferred to the heat pipe, and then to a cold plate which dissipates the energy to the ambient environment. The system does not require a plurality of fins inside the enclosure, liquid cooling, nor airflow within the enclosure to accomplish the memory thermal management. The invention includes a heat pipe saddle, a heat pipe, a clamshell heat extraction mechanism in conjunction with a thermal interface compound for improving the heat transfer from the DIMM to the heat sink.