The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Jul. 19, 2023
Applicant:

Jabil Inc., St. Petersburg, FL (US);

Inventors:

Lun Hao Tung, Butterworth, MY;

Lai Ming Lim, Bukit Mertajam, MY;

Zambri Samsudin, Gelugor, MY;

Assignee:

Jabil Inc., St. Petersburg, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/0283 (2013.01); H05K 1/181 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/0939 (2013.01);
Abstract

A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.


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