The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jul. 12, 2023
Huawei Technologies Co., Ltd., Shenzhen, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
A printed circuit board, which may be included an electronic communication device, includes a substrate, a bonding layer, a copper foil, and a filler. The substrate is provided with a cavity, and the cavity penetrates through the substrate. Two surfaces of the substrate are covered with the copper foil. The copper foil is bonded to the substrate by using the bonding layer. An outer surface of the copper foil is plated with a conductive metal layer. The filler is located inside the cavity. The substrate is provided with a through hole, and the through hole penetrates through the substrate and the bonding layer. A hole wall of the through hole is plated with a conductive metal layer. In this application, a dielectric constant Dk and a dielectric loss Df of the printed circuit board can be effectively reduced, and cost control is ensured.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile