The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Nov. 22, 2022
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Shiga, JP;

Inventors:

Shun Igarashi, Osaka, JP;

Ichiro Kuwayama, Osaka, JP;

Suguru Yamagishi, Osaka, JP;

Hiroshi Ueda, Osaka, JP;

Satoshi Kiya, Shiga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0228 (2013.01); H05K 1/115 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09636 (2013.01);
Abstract

A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.


Find Patent Forward Citations

Loading…