The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jan. 30, 2023
Sonion Nederland B.v., Hoofddorp, NL;
Raymond Mogelin, Hoofddorp, NL;
Sonion Nederland B.V., Hoofddorp, NL;
Abstract
The present invention relates to vibration sensor comprising a pressure detecting arrangement for detecting generated pressure variations, wherein the pressure detecting arrangement comprises a MEMS die and a signal processor, wherein the MEMS die comprises a front volume and a MEMS cartridge, and wherein the MEMS die comprises oppositely arranged first and second surfaces; a pressure generating arrangement for generating pressure variations in a coupling volume in response to vibrations of the vibration sensor, wherein the pressure generating arrangement comprises a frame structure comprising an indentation, a suspension member comprising first and second surfaces and a moveable mass secured to at least part of the first or second surfaces of the suspension member; and a PCB comprising a first surface, and a housing secured to the first surface of the PCB using an adhesive, wherein the housing and the first surface of the PCB define, in combination, a volume within which volume the pressure detecting arrangement and the pressure generating arrangement are arranged, wherein the coupling volume is defined by the indentation of the frame structure and at least part of the second surface of the suspension member, and wherein said coupling volume is acoustically connected to the MEMS cartridge of the MEMS die via an acoustical opening in the frame structure, and wherein the first surface of the MEMS die is secured to at least part of the frame structure, and wherein at least part of the second surface of the MEMS die is secured to the first surface of the PCB. The present invention further relates to a hearing device comprising such a vibration sensor, and to use of such a vibration sensor for detecting voice induced vibrations in the skull of a user of a hearing device.