The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jun. 28, 2023
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Masanari Miura, Nagaokakyo, JP;
Kiyoshi Aikawa, Nagaokakyo, JP;
Hiroyuki Nagamori, Nagaokakyo, JP;
Takanori Uejima, Nagaokakyo, JP;
Yuji Takematsu, Nagaokakyo, JP;
Takahiro Yamashita, Nagaokakyo, JP;
Ryo Wakabayashi, Nagaokakyo, JP;
Yoshihiro Yoshimura, Nagaokakyo, JP;
Takashi Hirose, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.