The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Feb. 27, 2024
Applicant:

Osaka Gas Co., Ltd., Osaka, JP;

Inventors:

Mitsuaki Echigo, Osaka, JP;

Hisao Ohnishi, Osaka, JP;

Yuji Tsuda, Osaka, JP;

Kyohei Manabe, Osaka, JP;

Kazuyuki Minami, Osaka, JP;

Assignee:

Osaka Gas Co., Ltd., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 8/1253 (2016.01); H01M 8/1246 (2016.01); H01M 8/12 (2016.01);
U.S. Cl.
CPC ...
H01M 8/1246 (2013.01); H01M 2008/1293 (2013.01); H01M 2300/0074 (2013.01);
Abstract

Provided is a low-cost electrochemical element that has excellent performance, reliability, and durability. Also, provided is a manufacturing method for an electrochemical element including a metal substrate (metal support) and an electrode layer formed on/over the metal substrate. The method includes an electrode layer forming step of forming an electrode layer having a region with a surface roughness of 1.0 μm or less on/over the metal substrate, and an electrolyte layer forming step of forming an electrolyte layer by spraying aerosolized metal oxide powder onto the electrode layer.


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