The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Feb. 22, 2024
Applicant:

E Ink Holdings Inc., Hsinchu, TW;

Inventors:

Yen-Ze Huang, Hsinchu, TW;

Jen-Shiun Huang, Hsinchu, TW;

I-Feng Cheng, Hsinchu, TW;

Kuang-Heng Liang, Hsinchu, TW;

Ming-Huan Yang, Hsinchu, TW;

Assignee:

E Ink Holdings Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1679 (2019.01); G02F 1/167 (2019.01);
U.S. Cl.
CPC ...
G02F 1/1679 (2019.01); G02F 1/167 (2013.01);
Abstract

A display device includes a driving substrate, a display medium layer, a protection assembly, a sealant layer, a driving chip, and a conductive substance. The driving substrate has a display area, a sealed area, and a peripheral area. The display medium layer is disposed in the display area of the driving substrate. The protection assembly is located on the display medium layer and includes a cover plate and a transparent conductive layer disposed on the cover plate. The sealant layer is disposed in the sealed area of the driving substrate to as least cover a periphery of the display medium layer. The driving chip is disposed in the peripheral area of the driving substrate. The conductive substance is disposed on the transparent conductive layer of the protection assembly. An orthographic projection of the conductive substance on the driving substrate overlaps the peripheral area of the driving substrate, and the transparent conductive layer is electrically connected with the driving substrate through the conductive substance.


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