The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Dec. 22, 2023
Applicant:

Yanshan University, Qinhuangdao, CN;

Inventors:

Wei Wang, Qinhuangdao, CN;

Chang Zhao, Qinhuangdao, CN;

Xiaochen Kang, Qinhuangdao, CN;

Hongda Yang, Qinhuangdao, CN;

Wenchao Li, Qinhuangdao, CN;

Zheng Li, Qinhuangdao, CN;

Lin Shi, Qinhuangdao, CN;

Assignee:

YANSHAN UNIVERSITY, Qinhuangdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/02 (2006.01);
U.S. Cl.
CPC ...
G02B 6/02366 (2013.01);
Abstract

A dispersion-compensation microstructure fiber uses pure silica glass as the background material. It includes the core, the first-type defects, the second-type defects and the cladding. The air holes in the fiber cross section are arranged in the equilateral triangle lattice with the same adjacent air-hole to air-hole spacing. The core is formed by omitting 1 air hole. The first-type defects are formed by the 6 air holes locating at the vertices of hexagonal third-layer porous structure surrounding the core and their surrounding background material. The second-type defects are formed by the air holes in the first air-hole layer surrounding each first-type defect and their surrounding background material. The second-type defects act as the porous structure to surround the first-type defects and the fundamental defect modes, and can also combine with the first-type defects to act as the core of the second-order defect modes.


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