The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Apr. 01, 2020
Applicant:
Meridian Innovation Pte Ltd, Singapore, SG;
Inventors:
Ilker Ender Ocak, Singapore, SG;
Piotr Kropelnicki, Singapore, SG;
Assignee:
Meridian Innovation Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/12 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); G01J 5/02 (2022.01); G01J 5/04 (2006.01); G01J 5/0801 (2022.01); H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
G01J 5/12 (2013.01); B81B 7/0006 (2013.01); B81B 7/0035 (2013.01); B81B 7/0038 (2013.01); B81B 7/02 (2013.01); B81C 1/00222 (2013.01); B81C 1/00246 (2013.01); B81C 1/00269 (2013.01); G01J 5/022 (2013.01); G01J 5/0225 (2013.01); G01J 5/045 (2013.01); G01J 5/0801 (2022.01); H10F 39/026 (2025.01); H10F 39/184 (2025.01); B81B 2207/012 (2013.01);
Abstract
A complementary metal oxide semiconductor (CMOS) device embedded with microelectromechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermosensors. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the device using wafer-level vacuum packaging techniques.