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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12631437 B1

PDFFull Text
Date of Patent:
May. 19, 2026

Filed:

Nov. 09, 2023

Sensor unit and sensor unit attachment method

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Takehiko Iizuka, Kyoto, JP;

Nobuyuki Nozawa, Kyoto, JP;

Tomoshige Furuhi, Kyoto, JP;

Koji Kawano, Kyoto, JP;

Takashi Watanabe, Kyoto, JP;

Jun Makino, Kyoto, JP;

Kenta Ago, Kyoto, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Peter J Macchiarolo

Assistant Examiner:

John M Royston

Int. Cl.
CPC ...
G01B 7/16 (2006.01); G01B 5/00 (2006.01); G01L 1/16 (2006.01);
U.S. Cl.
CPC ...
G01B 7/16 (2013.01); G01B 5/0023 (2013.01); G01L 1/16 (2013.01);
Abstract

Provided is a sensor unit including a first sensor portion that detects deformation of a measuring target object and a second sensor portion that detects deformation of the measuring target object, in which in a state in which the first sensor portion and the second sensor portion are attached to the measuring target object, the first sensor portion and the second sensor portion are fixed to the measuring target object such that the measuring target object is disposed between the first sensor portion and the second sensor portion in a first direction, and a physical property value of the first sensor portion and a physical property value of the second sensor portion are changed according to first deformation of the measuring target object.

Find Patent Forward Citations

Iizuka, Takehiko. (2026). Sensor unit and sensor unit attachment method (U.S. Patent No. 12631437). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12631437

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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