The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Nov. 15, 2022
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Abstract
Provided is an aqueous composition for roughening the surface of a rolled copper foil. The aqueous composition contains hydrogen peroxide, sulfuric acid, and an azole compound and/or a salt thereof. Based on the total mass of the aqueous composition, the content of hydrogen peroxide is 0.1 to 5% by mass, the content of sulfuric acid is 0.5 to 15% by mass, and the content of the azole compound is 0.01 to 0.3% by mass. The molar ratio of hydrogen peroxide to sulfuric acid is in the range of 0.1 to 1.0. The azole compound is a benzotriazole compound and/or a tetrazole compound. Also provided are a method for roughening a copper foil using the aqueous composition, a method for producing a roughened copper foil using the aqueous composition, a roughened copper foil, and a flexible printed circuit board using the roughened copper foil.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile