The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Apr. 17, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Hyungsuk Moon, Suwon-si, KR;
Seungkoo Shin, Pohang-si, KR;
Minjung Kim, Suwon-si, KR;
Sanghwang Park, Pohang-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/00 (2006.01); C23C 14/02 (2006.01); C23C 14/18 (2006.01); C23C 14/58 (2006.01); C23C 16/24 (2006.01); C23C 16/40 (2006.01); C23C 16/56 (2006.01); C23F 1/16 (2006.01); G01N 21/3563 (2014.01); G01N 21/35 (2014.01);
U.S. Cl.
CPC ...
C23C 28/322 (2013.01); C23C 14/025 (2013.01); C23C 14/185 (2013.01); C23C 14/5873 (2013.01); C23C 16/24 (2013.01); C23C 16/401 (2013.01); C23C 16/56 (2013.01); C23F 1/16 (2013.01); G01N 21/3563 (2013.01); G01N 2021/3595 (2013.01);
Abstract
A method of fabricating sample wafers includes forming silver particles on a surface of a wafer, forming nanowires on the wafer, removing the silver particles, and terminating dangling bond sites from surfaces of the nanowires with deuterium.