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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12630748 B1

PDFFull Text
Date of Patent:
May. 19, 2026

Filed:

Feb. 15, 2022

Pressure-sensitive adhesive

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Byung Su Park, Daejeon, KR;

Hyun Cheol Kim, Daejeon, KR;

Hui Je Lee, Daejeon, KR;

Seung Yeon Ryu, Daejeon, KR;

Jin Ho Son, Daejeon, KR;

Assignee:

Xinmei Fontana Holding (Hong Kong) Limited, Hong Kong, CN;

Attorney:

Ricky Lam

Primary Examiner:

Fred M Teskin

Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01); C09J 133/08 (2013.01); C09J 2301/302 (2020.08); C09J 2301/312 (2020.08); C09J 2301/414 (2020.08); C09J 2433/00 (2013.01); C09J 2467/006 (2013.01);
Abstract

A pressure-sensitive adhesive, which is applied to a flexible device, thereby effectively responding to repeated deformation and recovery, causing no defects (for example, observation of deformation traces and the like) before and after deformation, having excellent cuttability and workability, and causing no lifting, delamination, and/or bubble generation, and a use thereof are provided.

Find Patent Forward Citations

Park, Byung. (2026). Pressure-sensitive adhesive (U.S. Patent No. 12630748). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12630748

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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