The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Dec. 11, 2020
Applicant:

Ppg Industries Ohio, Inc., Cleveland, OH (US);

Inventors:

Liang MA, Allison Park, PA (US);

Lorraine Hsu, Allison Park, PA (US);

Allison G. Condie, Valencia, PA (US);

Marvin M. Pollum, Jr., Pittsburgh, PA (US);

Maria S. French, Berkshire, GB;

Assignee:

PPG Industries Ohio, Inc., Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 181/04 (2006.01); B29C 48/00 (2019.01); B33Y 70/10 (2020.01); C09K 5/14 (2006.01); H01M 10/613 (2014.01); H01M 10/653 (2014.01); H01M 10/6551 (2014.01); H01M 10/6554 (2014.01); H01M 50/209 (2021.01); H01M 50/471 (2021.01); B33Y 10/00 (2015.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01); C08K 5/09 (2006.01);
U.S. Cl.
CPC ...
C09D 181/04 (2013.01); B29C 48/022 (2019.02); B33Y 70/10 (2020.01); C09K 5/14 (2013.01); H01M 10/613 (2015.04); H01M 10/653 (2015.04); H01M 10/6551 (2015.04); H01M 10/6554 (2015.04); H01M 50/471 (2021.01); B29K 2995/0007 (2013.01); B29K 2995/0013 (2013.01); B33Y 10/00 (2014.12); C08K 3/22 (2013.01); C08K 2003/2227 (2013.01); C08K 3/28 (2013.01); C08K 2003/282 (2013.01); C08K 3/38 (2013.01); C08K 2003/385 (2013.01); C08K 5/09 (2013.01);
Abstract

Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.


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