The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Apr. 11, 2023
Applicant:

Shpp Global Technologies B.v., Bergen op Zoom, NL;

Inventors:

Weibing Teng, Selkirk, NY (US);

Hao Zhou, Mt. Vernon, IN (US);

Assignee:

SHPP Global Technologies B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 71/00 (2006.01); C08K 7/14 (2006.01);
U.S. Cl.
CPC ...
C08L 71/00 (2013.01); C08K 7/14 (2013.01); C08K 2201/004 (2013.01); C08L 2203/30 (2013.01);
Abstract

Thermoplastic compositions include: from about 50 wt % to about 70 wt % of a PEEK (polyether ether ketone) component; from about 5 wt % to about 20 wt % of a PEI (polyetherimide) component; and from about 20 wt % to about 40 wt % of a glass fiber component. The combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition. Methods for forming a molded article including the thermoplastic composition are described.


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