The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Apr. 12, 2022
Applicant:
Oji Holdings Corporation, Tokyo, JP;
Inventors:
Shigeru Suzuki, Tokyo, JP;
Yoshikazu Fujishiro, Tokyo, JP;
Kazuyuki Hiate, Tokyo, JP;
Yoshimune Okuyama, Tokyo, JP;
Masahiro Nakata, Tokyo, JP;
Tadakazu Ishiwata, Tokyo, JP;
Toshitsugu Takagaki, Tokyo, JP;
Assignee:
OJI HOLDINGS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/085 (2006.01); B32B 27/32 (2006.01); H01G 4/32 (2006.01);
U.S. Cl.
CPC ...
B32B 15/085 (2013.01); B32B 27/32 (2013.01); H01G 4/32 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2307/308 (2013.01); B32B 2307/518 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/16 (2013.01);
Abstract
Provided is a metallized polypropylene film having excellent insulation breakdown resistance properties. The metallized polypropylene film of the present invention has a thickness of 0.5 to 4.0 μm and has a feature such that the number of insulation breakdown points multiplied by thickness, as determined under predetermined measurement conditions for measuring the number of insulation breakdown points, is 1.90 (points/cm)·μm or less.