The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Dec. 22, 2021
Applicant:

Husky Injection Molding Systems Ltd., Bolton, CA;

Inventors:

Stephan Scherer, Trierweiler, DE;

Tobias Naumann, Merzig, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 55/16 (2006.01); B29C 45/00 (2006.01); B65D 41/34 (2006.01); B29L 31/56 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0081 (2013.01); B29C 45/0017 (2013.01); B65D 41/3447 (2013.01); B65D 55/16 (2013.01); B29C 2045/0093 (2013.01); B29K 2905/10 (2013.01); B29L 2031/565 (2013.01); B65D 2401/30 (2020.05); B65D 2401/50 (2020.05);
Abstract

A molding apparatus for molding a closure device for a container. The closure device may be tethered to the container, and may open and close via a hinged articulation. The closure device includes a cylindrical body comprising hinge-connecting areas with pockets formed in the interior wall and defining an inner surface of the hinge-connecting areas, and hinges extending downwardly from the hinge-connecting areas and positioned at or below a bottom edge of the cylindrical body. The molding apparatus comprises a cavity insert component and a core component that cooperate to form mold surfaces to mold the closure device such that hinges are located below the cap area of the closure device, and hinge-connecting areas formed by projections in the core mold component and recesses in the cavity mold component are located within the cap area are flanked by membranous areas.


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