The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Nov. 15, 2019
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Saneyuki Goya, Tokyo, JP;

Ryuichi Narita, Tokyo, JP;

Akiko Inoue, Tokyo, JP;

Hiroki Mori, Tokyo, JP;

Ryota Ozaki, Tokyo, JP;

Masahiko Shimizu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/082 (2014.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/082 (2015.10);
Abstract

In this laser cutting method and laser cutting device with which a base material is cut by irradiating, with laser, a surface of a base material formed of a composite material, an irradiation step for swinging the laser in a tolerance direction crossing the length direction of a cutting line while moving the laser relative to the base material along the length direction of the cutting line for cutting the base material is repeatedly performed on the cutting line, thereby cutting the base material, and in the irradiation step, a swing width in the width direction of the laser is decreased as the depth in the depth direction from the surface of the base material toward the rear surface increases.


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