The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jul. 07, 2023
Sandisk Technologies, Inc., Milpitas, CA (US);
Jingyun Chen, Shanghai, CN;
Lian Chen, Shanghai, CN;
Guangqiang Li, Shanghai, CN;
Pengchen AI, Shanghai, CN;
Yuanheng Zhang, Shanghai, CN;
Huijie Zhu, Shanghai, CN;
Wenbin Qu, Shanghai, CN;
Yonglong Liu, Shanghai, CN;
Xiaoting Guo, Shanghai, CN;
Guiyang Jiang, Shanghai, CN;
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
An annular structure for an electronic flame off (EFO) wand of a wire bonder is positioned beneath a capillary of the wire bonder. The annular structure provides uniform heat to a bond wire extending from the capillary to form a free air ball (FAB). Because heat is uniformly applied to the bond wire, the FAB is uniformly formed and is centered with respect to the capillary. The FAB is then bonded to a bond pad of a substrate. Because the FAB was uniformly formed and is centered on the capillary, the FAB will also be centered on the bond pad.