The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Dec. 10, 2022
Applicant:

Semikron Elektronik Gmbh & Co. KG, Nuremberg, DE;

Inventors:

Stefan Oehling, Uttenreuth, DE;

Jürgen Steger, Hiltpolstein, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/49811 (2013.01);
Abstract

A method for manufacturing a power semiconductor module and a power semiconductor module having, in each case, a housing, a switchgear arranged in this housing and having a plurality of connection elements, has the following method steps: A) forming a housing with pre-fixed connection elements; B) arranging the switchgear in the housing and connecting the connection elements to connection surfaces of a substrate of the switchgear; C) arranging a positioning device for fixing the position of the connection elements with respect to one another; D) fixing the connection elements relative to one another and to the housing.


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