The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Oct. 17, 2022
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Naoki Ikeda, Tokyo, JP;
Kazuki Koda, Tokyo, JP;
Shuhei Yokoyama, Tokyo, JP;
Shogo Shibata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 90/811 (2026.01); H10W 74/111 (2026.01); H10W 90/753 (2026.01); H10W 90/756 (2026.01);
Abstract
A semiconductor device includes: a rectangular RC-IGBT; an IC chip electrically connected to the RC-IGBT; a plurality of control terminals electrically connected to the IC chip; a plurality of power terminals electrically connected to the RC-IGBT; and a rectangular sealing resin covering the RC-IGBT and the IC chip. The RC-IGBT has an aspect ratio of 1.62 or more, the sealing resin has a lengthwise length of 44 mm or smaller, and the semiconductor device has a rated current of 25 A or more.