The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
May. 24, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jeongho Lee, Suwon-si, KR;
Doohwan Lee, Asan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a redistribution portion including an insulating layer, a redistribution layer, and a redistribution via, an under-bump metallurgy (UBM) layer below the redistribution portion and including a UBM pad on a lower surface of the redistribution portion and a UBM via on the UBM pad to penetrate through the insulating layer, a semiconductor chip on an upper surface of the redistribution portion and electrically connected to the redistribution layer, an adhesive layer between the UBM layer and the insulating layer and including a conductive material, and a connection bump below the UBM pad and connected to the UBM layer. The UBM pad has a first diameter, and the UBM via has a second diameter, less than the first diameter, and an upper surface of the UBM pad is located on the same level as, or a level lower than, a lower surface of the insulating layer.