The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jan. 12, 2023
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Jisong Jin, Shanghai, CN;
Abstract
This disclosure relates to a packaging structure and a packaging method. The structure includes: a substrate; a first chip, including a first surface and a second surface opposite to each other; a second chip, including a third surface, where the third surface includes a third bonding region bonded to the second bonding region, and a remaining region of the third surface is used as a fourth bonding region; a conductive post, arranged in the fourth bonding region; and a chipset, bonded to the first bonding region of the first chip, where the second bonding region is exposed from a projection of the chipset on the first chip. The chipset includes one or more third chips stacked along a longitudinal direction, adjacent third chips along the longitudinal direction are electrically connected, and the third chip adjacent to the first chip is electrically connected to the first chip.