The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jun. 15, 2021
Applicant:
Lipac Co., Ltd., Seoul, KR;
Inventors:
Dong Woo Park, Seoul, KR;
Seong Wook Choi, Seoul, KR;
Assignee:
LIPAC CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 25/16 (2023.01); H01L 29/16 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/165 (2013.01);
Abstract
A method for forming a package includes: molding a semiconductor chip and a light-emitting element; forming a redistribution layer (RDL) which electrically connects the semiconductor chip to the light-emitting element; and arranging a light-receiving element on the redistribution layer to be electrically connected thereto. The light-receiving element is arranged such that at least a portion thereof is located directly above the semiconductor chip.