The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Oct. 22, 2021
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Rong Wang, Beijing, CN;

Bo Zhang, Beijing, CN;

Qian MA, Beijing, CN;

Xiangdan Dong, Beijing, CN;

Xiaoqing Shu, Beijing, CN;

Yagui Gao, Beijing, CN;

Erlong Song, Beijing, CN;

Jiaxing Zhao, Beijing, CN;

Yuting Fu, Beijing, CN;

Chengchu Tseng, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); G09G 3/32 (2016.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01); H10K 59/00 (2023.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); G09G 3/32 (2013.01); H10H 20/857 (2025.01); H10H 29/142 (2025.01); G09G 2310/0267 (2013.01); H10K 59/00 (2023.02);
Abstract

A display substrate and a display device are provided. The display substrate includes a plurality of pads, an insulating layer and an inorganic layer located in a peripheral region. At least one of the pads includes a first conductor portion, a second conductor portion and a third conductor portion. The third conductor portion is located on a side of the second conductor portion away from abase substrate and electrically connected to the second conductor portion. The third conductor portion is electrically connected to the second conductor portion through a second via hole disposed in the inorganic layer of the peripheral region. A projection of the first conductor portion on the base substrate is located within a projection of the second via hole on the base substrate.


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