The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Apr. 02, 2024
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Adeel Ahmad Bajwa, Blue Bell, PA (US);
Thomas J. Colosimo, Jr., West Chester, PA (US);
Matthew B. Wasserman, Radnor, PA (US);
Robert N. Chylak, Warminster, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/0711 (2026.01); H10W 72/072 (2026.01); H10W 72/016 (2026.01); H10W 72/07125 (2026.01);
Abstract
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a manifold configured to provide a reducing gas to a bonding area of the bonding system. At least a portion of the manifold is heated.