The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Jun. 07, 2023
Applicant:

Admatechs Co., Ltd., Miyoshi, JP;

Inventors:

Shinta Hagimoto, Miyoshi, JP;

Nobutaka Tomita, Miyoshi, JP;

Susumu Abe, Miyoshi, JP;

Assignee:

ADMATECHS CO., LTD., Miyoshi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 72/00 (2026.01); H10W 72/30 (2026.01);
U.S. Cl.
CPC ...
H10W 72/013 (2026.01); H10W 72/30 (2026.01); H10W 72/01351 (2026.01); H10W 72/354 (2026.01);
Abstract

Provided is a method for producing an electronic material filler having excellent performance. The method includes a burning step of putting a particle raw material in flame obtained by burning combustible carbon-free gas containing no carbon to form a particle material to be contained in the electronic material filler. By adopting, as combustible gas, combustible gas containing no carbon, conductive particles formed of carbon are not generated in principle. Therefore, a step of removing the conductive particles formed of carbon by sieving or the like is not required. Particularly, carbon derived from hydrocarbon gas is adhered to and formed on, for example, the surface of the particle material or is formed in the particle material. Therefore, the carbon may not be completely removed by sieving or the like. However, the production method of the present invention prevents the carbon from being mixed in principle.


Find Patent Forward Citations

Hagimoto, Shinta. (2026). Semiconductor mounting material filler and method for producing semiconductor mounting material filler, and semiconductor mounting material (U.S. Patent No. 12628681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628681

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