The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jan. 13, 2023
Applicant:
Stmicroelectronics (Tours) Sas, Tours, FR;
Inventors:
Assignee:
STMICROELECTRONICS (TOURS) SAS, Tours, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/47 (2026.01);
U.S. Cl.
CPC ...
H10W 70/657 (2026.01); H10W 70/095 (2026.01); H10W 70/65 (2026.01); H10W 74/016 (2026.01); H10W 74/121 (2026.01); H10W 74/47 (2026.01);
Abstract
The present disclosure concerns a method of manufacturing an electronic component and the obtained component, comprising a substrate, comprising the successive steps of: depositing a first layer of a first resin activated by abrasion to become electrically conductive, on a first surface of said substrate comprising at least one electric contact and, at least partially, on the lateral flanks of said substrate; partially abrading said first layer on the flanks of said substrate.