The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Oct. 05, 2022
Applicant:
Mektec Corporation, Tokyo, JP;
Inventor:
Azumi Tominaga, Tokyo, JP;
Assignee:
MEKTEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/05 (2026.01); G06K 19/07 (2006.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 74/10 (2026.01); H10W 70/66 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); G06K 19/0723 (2013.01); H10W 70/05 (2026.01); H10W 70/68 (2026.01); H10W 74/114 (2026.01); H10W 70/66 (2026.01);
Abstract
Provided is a component mount board having a structure capable of more reliably sensing a state of the component mount board being soaked in liquid. A component mount boardincludes a boardhaving a basea first conductive patternformed on the baseand a mount componentelectrically connected to the first conductive patternand a second conductive patternforming a circuittogether with the first conductive patternin a complementary manner. A portion of the basecorresponding to the second conductive patternis a missing portionwhere the baseis missing. The second conductive patternis soluble in liquid, or is weakened when becoming wet with liquid.