The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jul. 28, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sangkyu Lee, Suwon-si, KR;
Doohwan Lee, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a frame having a first surface and a second surface, and including a wiring structure and a through-hole. The package further includes a first redistribution structure disposed on the first surface of the frame and including a first insulating layer and a first redistribution layer on the first insulating layer and connected to the wiring structure, a bridge die in the through-hole and having an interconnector, and an encapsulant surrounding the bridge die, and covering the second surface of the frame. The package further includes a second redistribution structure disposed on the encapsulant, and including a second insulating layer and a second redistribution layer on the second insulating layer and connected to the interconnector and the wiring structure, and a plurality of semiconductor chips disposed on the second redistribution structure, connected to the second redistribution layer, and electrically connected to each other through the interconnector.