The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Dec. 06, 2022
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Shintaro Hayashi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 70/04 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 72/90 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/424 (2026.01); H10W 70/042 (2026.01); H10W 70/417 (2026.01); H10W 74/014 (2026.01); H10W 74/111 (2026.01); H10W 72/073 (2026.01); H10W 72/075 (2026.01); H10W 72/352 (2026.01); H10W 72/884 (2026.01); H10W 72/952 (2026.01); H10W 90/736 (2026.01); H10W 90/756 (2026.01);
Abstract

A lead frame including a die pad having a first surface and a second surface opposite the first surface, a lead having a third surface flush with the first surface and a fourth surface opposite the third surface, and a link portion connecting the die pad and the lead, wherein the link portion includes a first portion that surrounds the die pad between the die pad and the lead in a plan view, wherein the first portion has a fifth surface flush with the first surface and the third surface, and has a sixth surface opposite the fifth surface, wherein the second surface is closer to a plane containing the first surface, the third surface, and the fifth surface than is the fourth surface, and wherein the sixth surface is closer to the plane containing the first surface, the third surface, and the fifth surface than is the second surface.


Find Patent Forward Citations

Hayashi, Shintaro. (2026). Lead frame, method of making lead frame, semiconductor apparatus, and method of making semiconductor apparatus (U.S. Patent No. 12628663). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628663

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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