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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12628660 B1

PDFFull Text
Date of Patent:
May. 12, 2026

Filed:

Aug. 31, 2021

Method for manufacturing electronic component device and electronic component device

Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Tomoaki Shibata, Tokyo, JP;

Naoya Suzuki, Tokyo, JP;

Assignee:
Attorney:

SHIPWAY IP

Primary Examiner:

Marlon T Fletcher

Assistant Examiner:

Christina A Sylvia

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A method for manufacturing an electronic component device including: preparing a wiring structure having a wiring portion including a metal wiring and an insulating layer and having two main surfaces opposite to each other, and a connection portion provided on one of the main surfaces of the wiring portion; fixing one or more conductor pins on the wiring substrate in a state in which the one or more conductor pins stand against the connection portion; mounting one or more electronic components on the wiring structure; and forming an encapsulation layer for encapsulating the electronic component and the conductor pin on the wiring structure.

Find Patent Forward Citations

Shibata, Tomoaki. (2026). Method for manufacturing electronic component device and electronic component device (U.S. Patent No. 12628660). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628660

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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