The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jul. 07, 2022
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Masatomi Harada, Nagaokakyo, JP;
Takeshi Kagawa, Nagaokakyo, JP;
Hiroshi Matsubara, Nagaokakyo, JP;
Nobuyoshi Adachi, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
A semiconductor device having a semiconductor substrate with first and second main surfaces that face one another in a thickness direction, and a circuit layer disposed on the first main surface. The circuit layer has a first electrode layer on the semiconductor substrate, a dielectric layer on the first electrode layer, a second electrode layer on the dielectric layer, and first and second outer electrodes electrically connected to the first and second electrode layers, respectively. The semiconductor substrate has a first end-portion region in which the circuit layer is not provided on the semiconductor substrate and on the side of the first end surface. In the first end-portion region, a first exposed portion is provided that is exposed between the first main surface and the first end surface.