The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Dec. 11, 2023
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jim Shih-Chun Liang, Poughkeepsie, NY (US);

Pouya Hashemi, Purchase, NY (US);

Michael Robbins, Danbury, CT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/00 (2026.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/033 (2026.01); H10W 20/425 (2026.01);
Abstract

Embodiments of the present disclosure include an interconnect structure having a via contact coupled to a middle of line (MOL) contact, a bottom of the via contact being free of a tantalum liner. A metal line is connected to the via contact, an interface between a top of the via contact and the metal line being free of the tantalum liner, the via contact and the metal line comprising copper, the via contact and the metal line being encapsulated with a cobalt liner.


Find Patent Forward Citations

Liang, Jim Shih-Chun. (2026). Back end of line interconnect structure (U.S. Patent No. 12628637). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628637

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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