The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Jan. 31, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyunhaeng Heo, Suwon-si, KR;

Sunghoon Kim, Suwon-si, KR;

Jaeick Son, Suwon-si, KR;

Seungyeon Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 80/00 (2023.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H10B 80/00 (2023.02);
Abstract

A semiconductor chip including a guard ring that surrounds edges of a semiconductor substrate, an internal circuit structure that is formed on the semiconductor substrate and that includes a memory cell array region and a peripheral circuit region, and a crack detection circuit that is located between the guard ring and the internal circuit structure and that detects whether a crack occurs. The semiconductor chip further includes first to fourth chamfer regions having different shapes and sizes depending on the position of a pad or the design arrangement of the internal circuit structure.


Find Patent Forward Citations

Heo, Hyunhaeng. (2026). Semiconductor chip having chamfer region for crack prevention (U.S. Patent No. 12628622). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628622

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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