The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Aug. 23, 2023
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Takeyuki Suzuki, Kaga Ishikawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Toshiba Electronic Devices & Storage Corporation, Kawasaki, JP;
Abstract
A method of manufacturing a semiconductor device according to an embodiment includes: the method of manufacturing a semiconductor device from a substrate and a sheet, the substrate including a semiconductor substrate including a first part including a first surface and a second surface provided on the opposite side of the first surface, and an annular second part surrounding the second surface and protruding from the second surface in a direction perpendicular to the second surface, and a first conductive film provided in contact with a top surface and an inner side surface of the second part, and the second surface, the sheet being attached to the first conductive film provided in contact with the top surface and the inner side surface of the second part, and the second surface; the method comprising: separating the second part from the first part by pressing a polishing tape against the first surface provided on the opposite side of the second part and polishing the semiconductor substrate; and cutting the first conductive film between the first part and the separated second part by pressing the polishing tape against the first conductive film between the first part and the separated second part.