The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Dec. 23, 2021
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Masaki Inaba, Kyoto, JP;

Akihisa Iwasaki, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/26 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 50/267 (2026.01); H10P 50/269 (2026.01); H10P 72/0421 (2026.01); H10P 72/0604 (2026.01);
Abstract

A wiring forming method includes a loading step (Si), an etching step (S), and a reducing step (S). In the loading step (S), a substrate having a metal wiring portion formed thereon is loaded into a chamber. In the etching step (S), an oxidizing gas is supplied to the substrate to etch one part of the metal wiring portion. In the reducing step (S), a reducing gas is supplied to the substrate to reduce an oxide film of the metal wiring portion formed by the etching step (S).


Find Patent Forward Citations

Inaba, Masaki. (2026). Wiring forming method and substrate processing apparatus (U.S. Patent No. 12628588). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628588

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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