The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Sep. 07, 2022
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Fujian, CN;

Inventors:

Min Huang, Fujian, CN;

Yu Zhan, Fujian, CN;

Zhanggen Xia, Fujian, CN;

Ling-Yuan Hong, Fujian, CN;

Su-Hui Lin, Fujian, CN;

Chung-Ying Chang, Fujian, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/831 (2025.01); H10H 20/815 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8312 (2025.01); H10H 20/815 (2025.01); H10H 20/857 (2025.01);
Abstract

A flip-chip light-emitting device includes a light-emitting unit, a first electrode, and a second electrode. The light-emitting unit includes a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first electrode is disposed on the light-emitting unit and electrically connected to the first type semiconductor layer. The second electrode is disposed on the light-emitting unit and electrically connected to the second type semiconductor layer. The first electrode or the second electrode is free of gold, and includes an aluminum layer and at least one platinum layer disposed on the aluminum layer opposite to the light-emitting unit.


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