The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Sep. 21, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Eun Bae Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 77/60 (2025.01);
U.S. Cl.
CPC ...
H10F 77/60 (2025.01);
Abstract

An image sensor package is provided. The image sensor package includes an image sensor, a substrate on which the image sensor is disposed on a first surface of the substrate and a receiving groove is disposed in a second surface of the surface, and a heat dissipation element including a heat absorption portion configured to absorb heat from a contact surface and a heat emission portion configured to emit heat absorbed by the heat absorption portion, and coupled to the second surface of the substrate, wherein, in the heat dissipation element, at least a portion of the heat absorption portion is accommodated in the receiving groove and coupled to the substrate.


Find Patent Forward Citations

Park, Eun. (2026). Image sensor package (U.S. Patent No. 12628462). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628462

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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