Integration of a detection circuit based on optical resonators interconnected on a readout circuit of an imager

Abstract

An optoelectronic device includes at least one pixel comprising: a plurality of optical resonators, each optical resonator comprising a photodetecting structure confined between a first reflective metal layer and a second metal layer; and a connection microstructure that is arranged on a support made of dielectric material and is configured to electrically interconnect the second metal layers of the optical resonators belonging to the same pixel; and a readout integrated circuit arranged on a substrate and assembled with the pixel; the readout circuit comprising a buried readout electrode associated with the pixel and a metal or dielectric outer layer. The assembly comprising at least the first metal layer and the outer layer of the readout integrated circuit is called a planar assembly structure. The second metal layers of the resonators of a pixel are connected to the associated readout electrode by way of a metal via connected to the connection microstructure and passing through the support.