The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Mar. 07, 2023
Applicant:

Ningbo Sunny Opotech Co., Ltd., Ningbo, CN;

Inventors:

Mingzhu Wang, Zhejiang, CN;

Takehiko Tanaka, Nara, JP;

Lifeng Yao, Zhejiang, CN;

Zhen Huang, Zhejiang, CN;

Nan Guo, Zhejiang, CN;

Xiaodi Liu, Zhejiang, CN;

Zhenyu Chen, Zhejiang, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/804 (2025.01); H10F 39/024 (2025.01); H10F 39/026 (2025.01); H10F 39/806 (2025.01);
Abstract

Disclosed is a photosensitive module (), adapted to a camera module, comprising a photosensitive element (), a light transmitting element () and an isolation adhesive layer (), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.


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