The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Nov. 10, 2022
Applicants:

Nuctech Company Limited, Beijing, CN;

Shenmutek Company Limited, Beijing, CN;

Tsinghua University, Beijing, CN;

Inventors:

Ziran Zhao, Beijing, CN;

Shoulu Jiang, Beijing, CN;

Xuming MA, Beijing, CN;

Assignees:

Nuctech Company Limited, Beijing, CN;

Shenmutek Company Limited, Beijing, CN;

Tsinghua University, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/10 (2025.01); H01L 23/544 (2006.01); H10F 71/00 (2025.01); H10F 77/40 (2025.01);
U.S. Cl.
CPC ...
H10F 39/107 (2025.01); H01L 23/544 (2013.01); H10F 71/00 (2025.01); H10F 77/413 (2025.01); H01L 2223/54426 (2013.01);
Abstract

Provided are a method of manufacturing a terahertz detection device including detectors and lenses arranged in an array and a terahertz detection apparatus. An example method includes forming detectors in a first area of a first surface of a base substrate through a double-sided photoetching process to form a detector array, and providing at least one first alignment mark in a second area of the first surface of the base substrate. A plurality of lens mounting parts are formed in a third area of a second surface of the base substrate through the double-sided photoetching process, and at least one second alignment mark is provided in a fourth area of the second surface of the base substrate. The lenses are mounted to the lens mounting parts to form the detection device. The first alignment mark is aligned with the second alignment mark by using a double-sided photoetching machine.


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