The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
May. 19, 2023
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventor:
Hidehiko Shimizu, Makinohara, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/189 (2026.01); H01M 50/519 (2021.01); H01M 50/588 (2021.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01M 50/519 (2021.01); H01M 50/588 (2021.01); H05K 2201/10022 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10181 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/2009 (2013.01); H05K 2201/2018 (2013.01);
Abstract
A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component. The first potting agent has higher flexibility as compared with the second potting agent.