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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12628274 B1

PDFFull Text
Date of Patent:
May. 12, 2026

Filed:

Jan. 24, 2022

Wiring board

Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Toshifumi Higashi, Kirishima, JP;

Hiroaki Sano, Kagoshima, JP;

Akira Imoto, Kirishima, JP;

Sentarou Yamamoto, Kagoshima, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Stanley Tso

Assistant Examiner:

Sidi M Maiga

Int. Cl.
CPC ...
H05K 1/09 (2006.01); B22F 7/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B22F 7/04 (2013.01); B22F 2301/10 (2013.01);
Abstract

A wiring board includes an insulation layer and an electrical conductor layer that are layered. The insulation layer is a glass ceramic. The electrical conductor layer is a sintered body of a plurality of crystallites containing copper as a main component. The plurality of crystallites include polygonal crystallites having linear sides. The plurality of crystallites are in contact with each other via the linear sides as grain boundaries.

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Higashi, Toshifumi. (2026). Wiring board (U.S. Patent No. 12628274). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628274

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