The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jun. 08, 2022
The Boeing Company, Chicago, IL (US);
Jesse A. Laplante, Monroe, WA (US);
Robert T. Johnson, Everett, WA (US);
Jin-Seog Seo, Mukilteo, WA (US);
Jacky-Vy C. Chau, Seattle, WA (US);
The Boeing Company, Arlington, VA (US);
Abstract
A wire bundle forming apparatus including a wire bundle form board having a plurality of mounting structure couplings, and at least one wire bundle mounting structure configured to couple with the plurality of mounting structure couplings for removably coupling the at least one wire bundle mounting structure to the wire bundle form board in a predetermined pattern corresponding to a predetermined configuration of a wire bundle. The at least one wire bundle mounting structure has a wire receiving portion. The at least one wire bundle mounting structure is common to both arranging at least one wire in the predetermined configuration for formation of the wire bundle, and, when removed from the wire bundle form board with the wire bundle coupled to the at least one wire bundle mounting structure, a fixture for coupling the wire bundle to a structure.