The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Sep. 02, 2021
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Takayuki Hattori, Osaka, JP;

Yukihiro Shimasaki, Hyogo, JP;

Hiroki Takeoka, Nara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 4/012 (2006.01); H01G 4/32 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/012 (2013.01); H01G 4/32 (2013.01);
Abstract

An electronic component includes an electronic component element and a barrier layer encapsulating the electronic component element. The barrier layer includes a clay layer containing clay. The clay layer is provided to surround the electronic component element. The clay layer may reduce a quantity of water passing through the barrier layer. The barrier layer includes a resin layer containing a resin. The clay layer and the resin layer are preferably stacked one on top of the other. The resin layer is preferably thicker than the clay layer.


Find Patent Forward Citations

Loading…