The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jun. 21, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Woohyun Son, Suwon-si, KR;
Jungwoo Jang, Suwon-si, KR;
Mincheol Kwak, Suwon-si, KR;
Taehong Jang, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor device includes a first semiconductor die including a first interface circuit; and a second semiconductor die stacked with the first semiconductor die and including a second interface circuit connected to the first semiconductor die by a plurality of via structures, wherein the first interface circuit is configured to generate an error detection code for transmission data and transmit the data signal including the transmission data and the error detection code to the second interface circuit through at least some of the plurality of via structures, and the second interface circuit is configured to generate response data indicating whether the data signal is normally received and an error correction code of the response data, and transmit a response signal including the response data and the error correction code to the first interface circuit through at least one via structure among the plurality of via structures.