The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jan. 28, 2022
Hiwin Technologies Corp., Taichung City, TW;
PO-Lin Lee, Taichung City, TW;
Hsien-Yu Chen, Taichung City, TW;
Yu-Sheng Chiu, Taichung City, TW;
Wen-Nan Cheng, Taichung City, TW;
Chih-Chun Cheng, Taichung City, TW;
Hiwin Techologies Corp., Taichung City, TW;
Abstract
A method and a system for building digital twin models allow the setting of a shape and dimensions of a simplified geometric solid corresponding to a component of a feeding system; after sampling the solid to obtain second position data, calculates a set of model eigenvalues and a set of model eigenvectors by a modal analysis method according to a material data of the component, the second position data and second size data of the solid; and defines the solid as a digital twin model of the component when it is determined by a modal verification method that a set of actual eigenvectors of the component is similar to the set of model eigenvectors. Data amounts of the second position and size data are far less than data amounts of first position and size data of an image of the component.